Electronics Forum | Thu Sep 17 21:45:50 EDT 1998 | Steve Gregory
Konichi wa "SMT-netter" sans... I've been on a fruitless search for some board mount, micro BGA sockets...I don't think they're out there yet, but I don't know for sure. Found a lot of test and burn-in sockets for CSP's (at more than $1,000 per copy
Electronics Forum | Fri Oct 02 14:38:45 EDT 1998 | Michael Kicinski
| Konichi wa "SMT-netter" sans... | I've been on a fruitless search for some board mount, micro BGA sockets...I don't think they're out there yet, but I don't know for sure. | Found a lot of test and burn-in sockets for CSP's (at more than $1,000 pe
Electronics Forum | Thu Sep 17 00:14:09 EDT 1998 | Kevin DeLillo
/= 1.67, the GSMs can handle the complete range of SMC components(0402-QFPs, BGAs, CSP, etc.)PLUS odd form components as well. And if that isn't enough, it can also dispense adhesive or solder paste. Universal's System Group can also put together a
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Fri Jan 17 04:07:12 EST 2003 | iman
A) Paste Printer : A1) identify the critical SMDs' pads. (choice should go to the BGA, CSP, MLF types...RES,CAP last in line...) A2) get a Paste measurement machine that measures readings of paste height (or better - volume) you are paste printing
Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh
Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha
Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Fri Apr 30 22:45:59 EDT 2004 | Bryan She
we can test the defects with multimeter after reflow ,before ICT.and if we replace this damaged parts with good ones.everthing is ok.I'm sure this part is damaged during reflow,but why not other 19 same parts of the 20 on each board?we attach a therm
Electronics Forum | Thu Dec 23 03:05:26 EST 2004 | Steve Stach
The Jury is still out on no-clean reliability in the long term as no-clean didn't gain wide spread acceptance until the early 1990's. Also, in today's disposable society, few products are expected to last 15-20 years. Experience has shown that if y
