Electronics Forum | Fri Jul 20 11:48:22 EDT 2007 | muse95
I agree with Chris. Not all but SOME components definitely had to change to be able to withstand higher heat. I would watch out for some plastic connectors, possibly some active components, and definitely many electrolytic caps. Older stock compone
Electronics Forum | Thu Oct 04 09:32:23 EDT 2007 | dilbert
Linear drive uses linear motors that have no moving parts, strictly a coil over magnets. "Rack and Pinion" as you call it uses AC servo motors that are driving belts and pullies The linear motor has no moving parts and is faster but generates a lot
Electronics Forum | Wed Feb 10 22:32:22 EST 2010 | davef
"Because of the rapid curing features of this product, large amounts of heat are generated when large masses of material are mixed at one time."[ITW Plexus MA310 TDS] Questions are: * Have you looked at the exotherm curve for this stuff? * Can the c
Electronics Forum | Fri Mar 19 13:18:03 EDT 2010 | deanm
Regarding your question about buying equipment to vacuum seal the MBBs, according to the IPC/JEDEC standard, "Full air evacuation is not needed or recommended; light air evacuation will reduce the packaging bulk and enhance carton packing. Excessive
Electronics Forum | Fri Oct 07 17:22:16 EDT 2011 | davef
Questions are: * Pressure? * Heating ramp? * Solder alloy? * Solder preform or paste reflow? [We have more, depending on your answer] * 0.5 mm is pretty tight. Talk about tooling holes and measures to prevent flexing of the assembly * In time, heat a
Electronics Forum | Fri Feb 01 10:54:35 EST 2013 | dyoungquist
Regardless of the surface finish, you should try to limit the reflow cycles to 3 with no more than 5 at most. This includes reworking a BGA site as well. Remember that heating/cooling to remove a BGA is one cycle and heating/cooling to place a BGA b
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Wed Jul 17 11:26:19 EDT 2013 | pbarton
What equipment do you have? As well as the comments from others, another major influencing factor can be the residual heat in your PCB carrier. It takes more heat energy to warm a cold carrier than if it is already hot from the last cycle run. This
Electronics Forum | Fri Aug 30 02:12:19 EDT 2013 | raqz
Hi! I have been studying the reflow process. And now, I am researching for a recommended reflow oven that can process a small to low-medium production SMT soldering. For the experts in the reflow field, please recommend a reliable reflow oven. Here
Electronics Forum | Tue Feb 18 11:47:50 EST 2014 | rgduval
Is there a reason you're considering bead-blasting the conformal coating? It seems like a bit of overkill. Most of the cc that I've used over the years either has a solvent that will dissolve it, or will dissolve with heat. Heat has been our go-to
