Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis
PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t
Electronics Forum | Mon Apr 13 09:27:28 EDT 2009 | hxr6038
We had an issue with the finish, PCB manufacturer is telling that they had a problem with the Nickel rework, which resulted in 20% fall out. Please help me by providing the ENIG thickness for Flex boards, is it same as rigid boards as per IPC 4552. I
Electronics Forum | Wed Dec 15 15:55:05 EST 1999 | Mike Naddra
As a general guidline I would agree with a 10% aperature reduction on chip caps , resistors, and fine pitch provided correct land geometries. When soldering to HASL surface finishes. Three things you may want to consider ; the stencil thickness, the
Electronics Forum | Fri Feb 12 05:53:32 EST 2010 | muarty
Hi Flipit, One of our customers has recently changed to this type of finish on their PCB's, due to them wire bonding MMIC devices in their factory after we do the SMT build. We found that we had to change all of our stencils for these products, as t
Electronics Forum | Thu Jul 20 16:04:22 EDT 2000 | Bob Willis
Tin/silver/copper is the alloy I have done most with and it would seem that it will be the alloy of choice if you look at the people doing the work. There are still some issues of fillet lifting which I have seen on PIHR soldering and the same in wav
Electronics Forum | Thu Aug 03 10:53:23 EDT 2000 | Roni Haviv
Hello, Does enyone have any experience with Immersion Tin (Sn) as a finish process on PCB ? Any information will help ! Thanks Roni
Electronics Forum | Mon Nov 06 12:43:35 EST 2023 | milas
Hi We are mounting an microphone device (SMT package) onto a PCB which has an ENIG finish and, observed some contamination on the underside of the device, post reflow. The SEM analysis shows that the contamination has a high level of Carbon. Where c
Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw
shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf
Electronics Forum | Wed May 03 13:06:54 EDT 2000 | Sal
GUYS SEEING A PROBLEM WITH SOLDER PASTE LEACHING. THE PCB IS HASL FINISH , AND THE DEVICE IN QUESTION IS A O.O30" PITCH RESNET. THE SIZE OF THE PADS ARE 0.020 x 0.0.047 THOU , THE APERTURE SIZES ARE 0.018 x 0.042 THOU . THE LEACHING IS OCCURING DUE
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