Electronics Forum: pcb thickness (Page 27 of 79)

Re: Stencil Aperture Reduction Guidelines

Electronics Forum | Wed Dec 15 15:55:05 EST 1999 | Mike Naddra

As a general guidline I would agree with a 10% aperature reduction on chip caps , resistors, and fine pitch provided correct land geometries. When soldering to HASL surface finishes. Three things you may want to consider ; the stencil thickness, the

Solder in via holes causing printing problems

Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe

We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac

Paste in hole (state of the art)

Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika

Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h

TNT-A capacitors placement problem at CP-6

Electronics Forum | Sat Dec 30 19:02:19 EST 2006 | mika

This type of component packages works best with vision type: 254 - irregular. Measure the total package length including the leads. Also set the body dimension x-y tolerances to at least 0.35mm and the the pick up x-y tolerences to 0.5mm in the part

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe

Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure

Thermal Conductive Adhesive Sheets (AUTO PLACEMENT PROCESS)

Electronics Forum | Tue Dec 11 18:50:47 EST 2018 | vinzon02

HI Rob; The thermal conductive adhesive needs to apply heat to stick on PCB. It's surface has not adhesive tape to fix it before placement of IC. Process: 1.Place the epoxy adhesive tape on PCB. (IC middle part area) 2.Apply heat on epoxy adhesive

Re: Use of solder paste for leaded thru hole parts????

Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh

| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p

QFNs (LCCs)

Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika

Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri

Looking for a PCB manufacturer.

Electronics Forum | Fri Dec 12 01:06:02 EST 2003 | kenny

Dear folks; I am currently looking a PCB manufacturer who can fabricate PCB with the following specification:- Board sizes: _20000__ x _20000__ mils Thickness: 125 mils PCB material: FR4 Surface finish: 30 microinches Gold over 200 micro inches Nic

Re: Warpage at Wave Soldering Stage

Electronics Forum | Mon Jun 14 13:47:54 EDT 1999 | Chrys Shea

| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre


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