Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Oct 31 19:17:47 EDT 2011 | tpappano
One of my CSM84VZs sometimes insists on "error 120, No Point" and also, today when configuring for a new pcb, "error 118, divide by zero". I see nothing in the board data to suggest divide by zero problems. The "no point" error showed up when I add
Electronics Forum | Tue Nov 08 21:56:23 EST 2011 | tpappano
Hi Jeff, both units have DC servos, and both appear to have the same vision system, although #2 has an additional upward-looking camera with a high magnification lens for die mounting. If I could make use of your hex files, that would be great sinc
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Fri Apr 03 08:34:54 EDT 2020 | SMTA-Gregory
We need to be careful with product to avoid introducing a new failure mode, namely corrosion and dendrite growth, especially those running no clean processes! In addition to heat (reflow, wave and some selective soldering processes) killing the vi
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen
| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S
Electronics Forum | Wed Jun 12 10:53:15 EDT 2002 | genny
350 candlepower is fairly low for high detail work. I spent some time in the construction industry laying out electrical blueprints for schools, and such. It was desirable to have more in the order of 700 fc for the desk surface that kids would wor
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
