Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC
Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
Electronics Forum | Thu Feb 19 13:52:58 EST 1998 | mike c
| We are in need of a low cost system for the rework of | various SMT devices. Ideally the machine should support BGA, | SQFP, and large PLCCs. | Is it a dream to ask for SMT tweezers, a regular iron, | and a convection pencil as well? Want a machin
Electronics Forum | Thu Feb 19 22:17:15 EST 1998 | Brian Morgan
| | I am currently evaluating some different reflow ovens | | for a future purchase. The manufacturers we are | | looking at are Conceptronic, BTU, and Heller. Any | | feedback on these manufacturers would be welcome. | | I am particularly interest
Electronics Forum | Sun Feb 15 10:47:16 EST 1998 | SMT-ASSY
In reference to your Email response, we will propose to you in the next few days a course curriculum which we hope you will find of great interest. As we told you we offer courses for assemblers and techs in PTH, SMT soldering, SMT full process using
Electronics Forum | Mon Jan 26 11:46:16 EST 1998 | Rin Or
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Thu Aug 23 00:10:21 EDT 2001 | mugen
Looky here people, 1) did imply *my* APPRECIATION for the replys posted herein... 2) If *me* appears to have no contribution to the forum, hope someone out there vaguely recalls some infrequently posted info *me* posted, that did get some joy & tha
Electronics Forum | Thu Aug 30 11:59:00 EDT 2001 | Spanky
Hey all, I have 3 questions about reflow. Hopefully someone can help me. 1. I am having a problem. I set the peak at 230 and my mole thermocouples are telling me the temp in that zone gets to 237. How is this possible even if the thermocouple
