Electronics Forum | Tue Dec 31 02:29:29 EST 2019 | sssamw
Do you have clear picture show how it looks like solder open? And you can run DOE with TAL and soak time and peak temperature to see which factor is key, or non of them is key then you can try add some flux to see if better before change solder past
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Tue Feb 11 14:37:26 EST 2020 | spoiltforchoice
If you're asking me, I'm using BLT LFS-UFP-T4 (they have an even better paste to treat badly now if you add zq). Those in the test of the world might find Loctite GC10 is similar, however the stencil and tack times on the BLT are pretty awesome and
Electronics Forum | Tue Mar 03 07:47:48 EST 2020 | dontfeedphils
Thanks for the info. In a past life I ran everything WS and washed in a batch wash using saponifier. I'm surprised I never saw anything then as we would regularly wash boards assembled on only one side. Unless it's specifically washing in DI only.
Electronics Forum | Tue Jun 23 05:52:15 EDT 2020 | ameenullakhan
Hi dave, Thanks for the input. your valuable feedback always help. which method is better Spindle or T-bar. IPC TM 650 have are considered as standard methods. 1. T bar 2. Spindle. since we have never used it. we are bit confused. Which would be
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Fri Sep 11 00:56:44 EDT 2020 | rsatmech
Thanks for your inputs. Soak - 120 to 180 at average 110sec Paste - Senju - S70G - Type 5 (also suspect paste chemistry yet it's customer defined I can't do anything about this) N2 - maintaining O2 PPM at 1000 Stencil - planning to reduce the stenci
Electronics Forum | Wed Jan 20 07:31:58 EST 2021 | denism
Hi, Option 3 is quite often used, while it is better to glue with uv glue using uv lamps for curing. For this process, two inverters are needed in the line, a dispenser for UV glue and a UV lamp (eg metronelec UV CURE OVEN). It is better to use prefo
Electronics Forum | Thu Oct 08 11:41:19 EDT 2020 | essusa
Not a sales pitch, just an update, the Essemtec jet print solution is maturing fast based on a lot of customer testing. It is fully capable to replace printers for prototyping and NPI. Being adaptive to different paste suppliers and different compone
Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech
My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.
