Electronics Forum | Thu Apr 21 00:09:12 EDT 2005 | Debbie Technical Devices
Any help locating a machine to remove foreign > materials from bare pcb's would be appreciated, There are several issues that should be addressed. There are several issues that should be addressed. Let's talk about your process and find out what
Electronics Forum | Fri Apr 08 05:10:10 EDT 2005 | siverts
What is Your customers requirements? Is the PCBA mounted with front/back connectors? Will the PCBA be mounded in a rack and connected to opposite connectors on the other side? In this case, if the warpage is more than approx 1-1.5 % You will then n
Electronics Forum | Sun Apr 10 06:27:50 EDT 2005 | WarpSpeed
1.) First of all: What is Your customers requirements??? 2.) If the customer or You don't have a specification; I will strongly recommend that you follow the "IPC-IPC-TM-650 Method 2.4.22 Bow & Twist" that [DaveF] suggested. 3.) If You have "critic
Electronics Forum | Wed Jun 01 07:34:19 EDT 2005 | davef
It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature. We print paste 1:1 with the pad. �IPC-7351 LP Wizard� is the library mainten
Electronics Forum | Mon Jun 13 09:17:05 EDT 2005 | russ
Some machines may require that the two locals be used to calculate a center point where some (probably most) just use them as a second positional identifier. The fiducials are programmed as just XY and just prior to placement the machine will read th
Electronics Forum | Thu Aug 04 12:40:38 EDT 2005 | Ted
Hi all, I am wondering what everyone is using as a PCB finish for RoHS. There doesn't seem to be a favorite out there. I know there are many companies using a gold finish but I don't want to pay that much and I have also heard about reliability p
Electronics Forum | Fri Sep 02 05:17:54 EDT 2005 | pyramus
I have another question can anybody assist me. Is there any specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin)? Moisture Sensitive Devices? or how about throw-out or left over parts? Is there any paste h
Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
Electronics Forum | Mon Sep 19 08:36:53 EDT 2005 | lloyd
I had a similar problem a few years ago when glue printing. Our production environment wasn't to clean room standards and there was a bit of air born contamination floating around which would gather on the PCB surface (also our rough board edges wou
Electronics Forum | Fri Sep 16 13:19:59 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
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