Electronics Forum: assemblers (Page 265 of 598)

0402 tombstones

Electronics Forum | Fri Apr 24 07:55:12 EDT 2009 | davef

TOMBSTONING OF 0402 AND 0201 COMPONENTS: "A STUDY EXAMINING THE EFFECTS OF VARIOUS PROCESS AND DESIGN PARAMETERS ON ULTRA-SMALL PASSIVE DEVICES" Michael Yuen, Heather Benedict, Kris Havlovitz, and Tim Pitsch, Plexus Electronic Assembly Corporation, N

Super low volume board wash. Will this work?

Electronics Forum | Fri May 15 13:17:18 EDT 2009 | tomsmiley

We implemented an inexpensive home dishwasher solution last year for cleaning assemblies. It works very well for both lead free and tin/lead cleaning. DI water at room temp is all we do and the boards come out squeaky clean. We had to use the least

QFN's and LGA's

Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva

Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht

BGA ball vs land design problem??

Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef

Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w

ROHS replacment parts

Electronics Forum | Wed Jun 10 08:46:20 EDT 2009 | rgduval

We generally purchase RoHS for all; leaving leaded-only assemblies as the exception. We process leaded and lead-free components together in leaded products with few issues. As long as the customer doesn't mind the mix (I'm sure that some out there

Solder Ball and Splash after Hand Soldering

Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef

Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu

How to remove Oxides from older components? Fine Pitch

Electronics Forum | Thu Jul 30 13:52:34 EDT 2009 | davef

Thoughts are: * 215-220 temperature at the leads is not real hot for leaded assembly. * It's peculiar for component leads to dewet. Sometimes non-wetting occurs along the edge of the lead where the lead is not plated. * How do the leads of a removed

Programming Mydata

Electronics Forum | Mon Aug 31 09:27:33 EDT 2009 | jamyboy

With Pronto Place I can generate a Mydata program and automatically merge an Excel bom in about 20 seconds. Takes longer if I need to produce assembly doxs...but still faster than Circuit Cam...have used the Mydata macro in the past also, but it does

Programming Mydata

Electronics Forum | Mon Nov 09 12:12:41 EST 2009 | mcmark

Same here, I've been programming Mydata placement machines using CircuitCAM since 1999, at 2 companies. With an ASCII CAD file imported and simple BOM scrubbing, we can get programs directly output to our Mydatas in less than 5 minutes. Developing as

Baking populated PCBs

Electronics Forum | Tue Aug 25 08:04:26 EDT 2009 | davef

Trapped moisture can be a problem, and one standard recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5ºC before conformally coating. [NASA-STD-8739.1, “Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Ele


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