Electronics Forum: 2.. (Page 267 of 1147)

Stencil foils delaminating

Electronics Forum | Tue Nov 14 00:09:33 EST 2006 | KEN

I would still verify what you are receiving and your current bath setup. This only because you are experiencing problems. Simple check, takes 2 minutes. I have seen this before, but it took 8 hours to delam at with pre-mix. This was 5 or 6 years

Stencil foils delaminating

Electronics Forum | Wed Nov 22 11:06:59 EST 2006 | stimpk

We had the same issue. Switch to the 440-R and remove your heat. Your wash cycle can be changed down to 2 minutes. Make sure to mix the correct amount, and you want have anymore delam's. Kevin S

BGA ball crack at pad/solder ball interface

Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq

Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach

Profiling Vapour Phase System

Electronics Forum | Thu Nov 30 13:41:04 EST 2006 | john_smith

Pete, We have 2 Vapor Phase ovens and use a profiler from Data Pak that has a sleeve that seals out the Vapor for these ovens. This is pretty much the only system that we have found for these kinds of ovens. Contact them and they will hook you up.Tha

IP1 Relay PCB, where is it???

Electronics Forum | Wed Dec 06 10:02:19 EST 2006 | cyber_wolf

Do IP1's use MFU's like the IP2's ? If so I can most likely tell you what the problem is.... Please advise.

Overprint, solder flow back

Electronics Forum | Tue Dec 05 08:23:14 EST 2006 | davef

How about a stepped stencil? Not ideal but ... As far as overprinting goes, try: http://www4.uic.com/wcms/WCMS2.nsf/index/Resources_44.html

Ways to control SMT gap to PCB

Electronics Forum | Fri Dec 08 11:30:19 EST 2006 | ganoi

We discussed about applying 2 dots of glue on either sides of the LED body, but have yet to try it out. Other discussions include conductive adhesive, using fixturing with weight, different stencil aperature design, hand soldering.

How much capacitor offset is acceptable?

Electronics Forum | Sun Dec 17 23:22:17 EST 2006 | bigdaddysoy9

If you are talking about a chip capacitor, then I think it's 50% (of component width) side to side for class 1 and 2. And 25% for class 3. There is no end overhang permitted for all 3 classes.

How much capacitor offset is acceptable?

Electronics Forum | Mon Dec 18 18:27:29 EST 2006 | bigdaddysoy9

This is end overhang: http://workmanship.nasa.gov/lib/insp/2%20books/links/sections/graphics/705/705-24.gif

maintain glue size

Electronics Forum | Tue Dec 19 04:04:52 EST 2006 | ec

Hi, I been facing this problem in the past...... Now, I have change to printing. In the past, glue dotting is my bottom neck and need to use 2 glue dotting machine....and now, with printing proces, no more bottom neck in glue process and quality als


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