Electronics Forum | Mon May 24 23:38:17 EDT 2021 | SMTA-64387687
What about dispensing SMT epoxy (cures at much lower temperatures, than solder reflow), p+p components, run through the oven to cure, and using a laser selective solder robot to solder the pads?
Electronics Forum | Fri Jun 04 11:38:47 EDT 2021 | bangir
Hi All, Do you have any experience for LGA component rework on SRT equipment? Please share how to re-soldering the LGA component to PCB pads. Thanks
Electronics Forum | Wed Sep 08 19:58:17 EDT 2021 | kylehunter
Yes, we soldered some Mil-Max pins on a functional test board before. Utter nightmare. We managed to finally get them on, but yes, terrible wetting, and they act as total thermal sinks. Make sure to oversize you pads.
Electronics Forum | Tue Sep 14 05:46:51 EDT 2021 | denism
To measure two 0201 pads, you need to solder two thermocouples for each component pin on different segments. Thermocouple wire should be 36AWG.
Electronics Forum | Thu Dec 02 17:57:54 EST 2021 | swilson
Hello I have a situation here. I am wanting to get wave pallet, but I have a TH component that is too close to the SMT pads looking at @.020" it should be .100" min. If I get a pallet will it not wet that TH component or will it work? Any R
Electronics Forum | Mon Dec 06 18:28:24 EST 2021 | emeto
What is your current paste coverage? You mentioned windowpane and you mentioned 5mil stencil. You did not mention if PAD design meets recommendation? If it does, go 6mil and more paste coverage to increase volume.
Electronics Forum | Tue Dec 07 08:01:40 EST 2021 | jineshjpr
Hi DucHoang, Thanks for your response - Understanding that OSP will have more surface resistivity which does not allows the solder to flow on the entire pads. Let me check peak & revert back sooner.
Electronics Forum | Tue Dec 07 14:15:18 EST 2021 | majdi4
Hello Jinesh , if you can provide us with component datasheet , stencil design vs PAD design (GBX) and the thermal profil you use.. It would help us to found out the issue and help you.
Electronics Forum | Thu Jan 20 13:56:51 EST 2022 | stivais
For me it seems that the board is already assembled & soldered. Before assembling the board had been (poorly) washed (misprint perhaps) and the spots are just melted solder paste. Aren't those solder balls in the grooves between the pads and solder
Electronics Forum | Fri Jan 21 06:35:51 EST 2022 | stivais
"Manual washing" of a misprint board basically is smearing of printed solder paste all over the board. And trying to remove (wipe off) it afterwards. So for me it would not be any surprise that the solder paste ended up on the pads where it was not i
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