Electronics Forum: package (Page 267 of 288)

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon

| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea

| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.

| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so

Re: T sub g

Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon

| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef

Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially

capacitors factory

Electronics Forum | Thu May 09 17:07:56 EDT 2002 | davef

Troubles, troubles, troubles. If it weren�t for bad luck, I wouldn't no luck at all, eh? Tough business. Comments on your trouble are: * On machine vision errors from less than ideal capacitors: This is life. Reprogram your machine to either wid

small and good pick and place machine

Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao

There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker

First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention

Re: SM Line Solution

Electronics Forum | Thu Apr 27 21:11:00 EDT 2000 | Dave F

Ken: There is no complete package solution to the concerns you have. You need to weave you way through this project. I�m generalizing when: Placement machine OEM: * Knows their machine (your interests are served if this is the proper machine for

Re: power dissipation design

Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F

Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par


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