Electronics Forum | Thu Apr 24 16:55:03 EDT 2008 | fredc
AOI stands for Automatic Optical Inspection doesn't it? I apologize for my ignorance on the original comment.
Electronics Forum | Tue Apr 29 20:26:03 EDT 2008 | sys_steven
You can adjust to 45mm clearance, But I would recommend staying at 25mm if working with fine pitch and smaller passive components.
Electronics Forum | Tue Apr 29 11:53:16 EDT 2008 | sliebl
We certainly take that into consideration. You will require additional time to process the board through your shop since as the previous poster mentioned, you need to print, place, and reflow (or cure) twice. Not to mention you will have additional N
Electronics Forum | Fri Apr 25 02:02:20 EDT 2008 | rfematt
I am looking for information on the feeders for a Sanyo TIM-1100L (feeders part number, where to buy, etc) Are they the same as Sanyo TCM3000/3500 feeders? I have been browsing but it doesn't seem to be a very popular machine. Regards, Rafael Fematt
Electronics Forum | Mon Apr 28 11:13:21 EDT 2008 | ck_the_flip
Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with no components using your standard profile. Observe the wetting spread and flow of the solder paste. This rules in/out that it's PCB solderability.
Electronics Forum | Fri Apr 25 13:30:45 EDT 2008 | flipit
I use Namics 8437-2 for micro BGA and flip chips. Will work for QFN or MLF after soldering. Flows well under gaps as thin as 0.001". Cure in 5-10 min at 150 C. Rock solid product. Is bit expensive. Is from Japan.
Electronics Forum | Fri May 02 11:36:21 EDT 2008 | fsw
I am of the same opinion! I don't think customer has clear idea of the underfill requirement. From our talks with them, it seems they feel that since the build is RoHS compliant, they feel more comfortable having an underfill on that component to cov
Electronics Forum | Sat Apr 26 08:18:47 EDT 2008 | davef
Your warpage problem could be caused by change in: * Multilayer board construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selections (usually cheap and dirty), etc.
Electronics Forum | Tue Apr 29 02:08:21 EDT 2008 | sin4d
Hi, I am also facing the same probelm. I assembly a substrate with a thickness of 0.30mm and the board warp after reflow. If I bake the substrate at 125 Deg C for 2 hours will it help to solve this problem? Thanks
Electronics Forum | Tue Apr 29 07:26:38 EDT 2008 | realchunks
Another area to look is on any breakaway. If they did not add copper to breakaway, it can warp your board if long enough. Seen it happen many times.
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