Electronics Forum | Sat May 13 17:15:06 EDT 2000 | Alek
I'm trying to find a procedure for smt handplacements& the best way to minimize the handplacments before the reflow process.Any steps should be taken ??
Electronics Forum | Wed May 10 21:15:45 EDT 2000 | dillard
I am looking for a similar forum as this for the test process. Such as Genrad and Teradyne platform forums. Anyone have any ideas?
Electronics Forum | Thu May 11 06:33:48 EDT 2000 | Cecep Wahyu
Dear, Give me information about Processing of Platting Circuits Board Sincerely, Cecep Wahyu
Electronics Forum | Mon May 22 11:32:29 EDT 2000 | Wolfgang Busko
Hi TVM, good thing! That looks like some useful information on that topic. For me it would provide a good start to try processes on 0201 with my own equipment and paste. You can bring more of such hints Regards Wolfgang
Electronics Forum | Wed May 17 17:13:47 EDT 2000 | Michael Parker
The MoonMan has spoken. Everybody get back up on the wall, its been long enough that this has been "off the wall". Wish I had more Rambus chips, just got my SMT process dialed in and ran out of stock. Damn.
Electronics Forum | Fri May 05 03:11:48 EDT 2000 | M. Rashad Ramzan
Hi, If any one of you guys can tell me the web sight which explains the manufacturing process for multilayer PCBs. Please reply on one of these mail addresses r_ramzan@yahoo.com or mrashad@enabtech.com Rashad
Electronics Forum | Wed May 03 21:07:36 EDT 2000 | Eric Chua
Hi Steve, I had face problem before. What I did, add addition process which is screen print that apply adhesive. During thru-hole assemble, the components hold strong by the solder. Try this.
Electronics Forum | Fri May 05 14:44:35 EDT 2000 | Kal Chakraborty.
Hi Ashok, Is there any rework process on those assembl./PWB ..if yes --what kind of tools are your operators using now ...brush? spudger? cloths (is it lint free?) ect. I hope you are not talking about nodules in the hole barrel. Regards Kc.
Electronics Forum | Thu Apr 20 11:18:06 EDT 2000 | Russ
C.K. I would like to receive the paper that you wrote, I am in process of implementing VOC free at our factory and could use all of the information that I can get. Thanks Russ
Electronics Forum | Fri Apr 14 15:46:17 EDT 2000 | Madan Mohan
I work on CSP Rework Process Development. Can anyone suggest a way by which the component top temperature during removal / replacement can be reduced for the same solder joint temperatures (for example providing metal shields over component top in t
