Electronics Forum | Tue Feb 16 08:54:57 EST 1999 | Ross Berntson
| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the
Electronics Forum | Wed Jan 20 14:28:50 EST 1999 | Dave F
| I have a severe problem with flux residue being drawn up the vent ducts of my reflow oven. This residue reaches a critical mass then begins to flow down the ducts and becomes very messy. I run a no-clean process and use IR oven. Has anyone else o
Electronics Forum | Fri Jan 08 17:56:16 EST 1999 | Eric Miller
Hi Chrys, Hate to bring you down, but, wave solder pallets exposed to any kind of flux is subject to "Build up" on the carrier. You still have to clean them, hopefully on a regular basis.If the pallet is being run in a high production envirnment, I w
Electronics Forum | Tue Jan 05 18:18:56 EST 1999 | Hallj
| If passive componets are cheaper why aren't they more popular? Manufacturers like Murata and AVX claim availability and substantial cost savings but little interest seems to exist. Why? Your input is greatly appreciated. | I use bulk fed compon
Electronics Forum | Wed Jan 06 18:00:34 EST 1999 | Enza Hill
I'm not sure I'm offering an answer, more a question I have...Isn't there an issue with automated PnP machines whose feeder carriage moves? Have companies such as Fuji, Universal/Sanyo, Panasonic developed the capability to use bulk feeders? I woul
Electronics Forum | Thu Dec 24 02:17:22 EST 1998 | Chris Grendler
Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The pit
Electronics Forum | Thu Dec 24 09:32:53 EST 1998 | Earl Moon
| Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The p
Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
Electronics Forum | Sun Dec 13 11:35:59 EST 1998 | Jim Gustin
I suggest that you display questions and responses in a slightly different order. Within any given string of Q's and A's, the topmost displayed item should be the oldest. The most recent item should be at the bottom. In this way, a viewer can easily
Electronics Forum | Tue Dec 15 09:15:12 EST 1998 | Clifford Peaslee @ SMTnet
| I suggest that you display questions and responses in a slightly different order. Within any given string of Q's and A's, the topmost displayed item should be the oldest. The most recent item should be at the bottom. In this way, a viewer can easil
