Electronics Forum | Wed Mar 08 17:01:32 EST 2000 | Russ
So far, I have not been able to get any consistant or good results using one of these "problem solvers". I have managed however, to screw up some good processes. I believe that this technology can work though. I would reccomend contacting Speedlin
Electronics Forum | Wed Feb 23 20:25:17 EST 2000 | Chris Wallace
Like all who post messages here, I'm looking for a little bit (well, maybe a lot of bit) of help. We're currently going through a redesign of a board which will utilize several FPGAs. The manufacturer (Xilinx) recommends using solder mask defined p
Electronics Forum | Wed Dec 20 21:01:12 EST 2000 | Dave F
Talk about glam jobs � About once a month, we�d go over to the slaughter yard to get cows� teeth for Dr. Mueller. Then we�d fixture them on their side and run them in a machine that scrubbed them with a brush for weeks. The cool thing about cows te
Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny
Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Tue Dec 12 13:33:52 EST 2000 | justin medernach
Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving that agitate the solder, the more dross. Basics first and then the answers will make sense. What is dross? Oxidatio
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F
Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections
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