Electronics Forum | Mon Oct 16 16:33:34 EDT 2023 | emeto
Based on these pictures, please check Board/Stencil co-planarity. Sometimes there might be a distance/gap between them helping this phenomenon(solder mask might be too thick). Also decreasing print speed, might help to mitigate it. You might be too f
Electronics Forum | Mon Oct 16 18:51:14 EDT 2023 | alexv
It looks to me that you might have a poorly etched/polished stencil. Also, I would check separation speed and distance.
Electronics Forum | Fri Oct 20 11:16:14 EDT 2023 | tommy_magyar
I agree, and also, assuming you have SPI (if the solder paste roll is measured by laser) the SPI should not fail a board for such amount of missing paste.
Electronics Forum | Fri Oct 20 21:26:49 EDT 2023 | dwl
I agree with Sr. Tech. What does the reflowed joint look like? Is there an actual defect in the solder joints? If its good, I wouldn't worry about the print not being text book perfect.
Electronics Forum | Mon Oct 23 20:38:06 EDT 2023 | stephendo
Time flies. 25 years ago we would have asked the durometer of the squeegee blades. But I have only seen metal ones in the last couple of decades.
Electronics Forum | Fri Aug 17 21:23:08 EDT 2018 | sarason
My program PCBSynergy will program your Juki from ALtium/Protel, Eagle, Kicad, PCBCSV files,Cadstar, GenCAD, PCAD, PADS and a few others still being written It can be found here:- https//:pcbsynergy.com sarason
Electronics Forum | Fri Oct 27 08:24:41 EDT 2023 | avaqsemi
When designing a PCB to accommodate an intrusive reflow narrow profile connector (electrode rectangular) with specific dimensions, you'll need to consider the pad size, hole size, and other factors to ensure proper solderability and mechanical stabil
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
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