Electronics Forum | Fri Feb 18 12:31:08 EST 2000 | Steve Thomas
I've got a process run amok, really thick skin, and a little bit of knowledge. Now you REALLY oughta be shakin' in your boots.
Electronics Forum | Tue Jan 16 07:02:47 EST 2001 | You Kim Huat
HI, Can someone advice me, is there any guideline to determince the opening for stencil during stencil fabrication. Also is there any method to determince whether the solder paste amount is enough during this process.
Electronics Forum | Tue Jan 16 07:07:03 EST 2001 | You Kim Huat
HI, Can someone advice me, is there any guideline to determince the opening for stencil during stencil fabrication. Also is there any method to determince whether the solder paste amount is enough during this process.
Electronics Forum | Fri Jan 19 17:41:15 EST 2001 | davef
How did you decide the problem is cosmetic? One possibility is poorly cured solder mask. Tell us more about your board, flux and solder materials, and wave process.
Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp
CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly
Electronics Forum | Mon Jan 29 16:12:05 EST 2001 | bill_scholl
I have been told that is is possible to reflow solder through hole components. Can anyone confirm this is being done reliably? If so, what are the required equipment, steps and processes? What is the reliability of the solder joints? Is this a genera
Electronics Forum | Wed Jan 31 20:11:32 EST 2001 | davef
"Statistical Process Control for Surface Mount Technology" (0967503396) William S. Messina, Ph.D., President, Data Sleuths, 8311 Via de Ventura #2075 Scottsdale, AZ 85258: 602-321-0549 Fax: 480-348-9636 datasleuth@yahoo.com
Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef
1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto
Electronics Forum | Mon Feb 05 21:19:45 EST 2001 | davef
We process a fairly wide variety of board designs. So, pot temperature is one of the controllable factors in DOE.
Electronics Forum | Mon Feb 19 18:40:43 EST 2001 | davef
Please take us through the options for processing the "waste" liquid that is loaded with solder, adhesives, and what not as a result of cleaning stencils and mis-printed boards. What are the costs for equipment, material disposal, and other items of
