Electronics Forum | Tue Feb 24 15:40:08 EST 2015 | mbartel
I'm new in this industry and need a little direction. I have a wide verity of SM parts on a board, top and bottom. The larger components have a very nice reflow, good shine. The 0402/0201's has a dull almost cold solder look. The boards function and
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon
| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered
Electronics Forum | Fri Feb 20 14:33:47 EST 1998 | Dave McFadyen
Looks like (so far) we have a concensus. Follow the paste manufacturers guidelines on storage. Normally, refrigeration is required to achieve max shelf life between 3 and 6 months in original closed container. Water-wash pastes are much more active t
Electronics Forum | Wed Jul 11 19:50:35 EDT 2001 | Pro-Con Technologies
50cents/gallon for N2 is steep, plus that is Liquid not gas??? As for conceptronics stating that your oven will consume 2100scfh is another situation. If your system operates on Air Amplifier technology it will consume alot of N2 and should be scrapp
Electronics Forum | Mon Sep 09 21:42:12 EDT 2002 | rwilliams
I have been involved with the reflow process for many years. However, my most recent position now includes the use of Nitrogen. In studying the reflow process and using Nitrogen, it seems to me that it would only make sense to be measuring the O2 lev
Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
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