Electronics Forum | Fri Sep 11 09:30:30 EDT 1998 | Earl Moon
| Heeeelllllp. | I am a sales rep. ( I know I know, you can't help me with that. ha ha.) Actually, I represent a company that fabricates PCBs and assembles them under the same roof. We are a small to moderate volume house that is just getting int
Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos
Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th
Electronics Forum | Fri Aug 07 02:30:08 EDT 1998 | Bob Willis
| | No sour grapes, | | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely on t
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Tue Apr 21 16:33:57 EDT 1998 | Cunli Jia @ SMTnet
Should this Forum be used for unsolicited sales? SMTnet has stipulated (in the FAQ page) that the SMT Forum messages are meant to be technical and not to be used for unsolicited advertising. However, we have not enforced this rule since 1, there
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Tue Apr 23 14:18:19 EDT 2002 | Ken Bliss
This is quite a list of frustration. Several asked if management is listening. We make carts to suport those machines you are complaining about service. Here is one senior managers view. There is no low level people in an organization that is man
Electronics Forum | Wed Aug 07 11:55:31 EDT 2002 | slthomas
Ron, have a look at http://www.fda.gov/cdrh/dsma/cgmphome.html It would be a nightmare, if your plant is not structured to support it. It's a huge pain in the fanny even when you (alledgedly) are. I'm not sure what you're pursuing, but if you're c
