Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Tue Aug 20 08:48:07 EDT 2013 | proceng1
If the parts are hand placed and hand trimmed, why do you need to inspect whether the lead is in the hole. The operator should be inserting the part correctly. We have MIRTEC machines and they do a pixel comparison to "known good images". With a m
Electronics Forum | Thu Aug 24 06:58:19 EDT 2006 | davef
Darby National published stencil recommendations for their LGA in the "SMT Assembly Recommendations" section of: http://www.national.com/an/AN/AN-1187.pdf Is it possible that Silicon Laboratories published a similar document for your Cygnal CP2101?
Electronics Forum | Tue Nov 24 05:23:18 EST 2009 | prodivegsr
Hi Davef, Thanks...Saw 1 of your thread that you posted : Thanks for providing... From davef : There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the
Electronics Forum | Wed Feb 12 12:06:58 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Thu Aug 24 19:26:07 EDT 2006 | darby
Dave, Cygnal was taken over by Silabs. I based my design on the second link that you provided. Tell me folks, are you using one large pad with only the stencil having the grid, or are you actually breaking up the large pad into grids with mask around
Electronics Forum | Wed Aug 11 15:58:39 EDT 1999 | Doug Philbrick
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
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