Electronics Forum | Thu Oct 15 11:04:53 EDT 1998 | Justin Medernach
| | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | Q: Can you get away with spending 25K?
Electronics Forum | Fri Jul 29 09:31:29 EDT 2005 | lupo
Hello, I am not familiar with Inertec but have some expirience with selective soldering process, My oppinion is that the wave and slective soldering are not the same game. In Selctive soldering process is very important the layout design. If use th
Electronics Forum | Wed Feb 15 19:20:46 EST 2006 | Mr. Samir
Russ, On both instruments, I ran them through the wave 20 times each using identical profiles and wave parameters, and then used statistical formulas to measure the variation and repeatability of each. I had these all in Excel, but that was around 1
Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko
Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc
Electronics Forum | Wed May 17 14:55:17 EDT 2000 | Earl Moon
OK folks, enough. Thanks for a reality check - though a bit Zappa, Waylon, or whatever like in the year 2000 but who's counting - Wayne? (good to see from you again concerning such a vital topic). The real question should be: Where'd you go? You done
Electronics Forum | Tue Jan 30 13:53:50 EST 2001 | cebukid
Wolfgang is correct - Dwell Time is influenced by conveyor speed and of course, pump speed. Contact Length (the length of contact between board and wave) is something that you might want to track. Contact Length greatly influences process defects l
Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew
For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ
Electronics Forum | Wed Jul 04 12:22:07 EDT 2001 | davef
Several points: * Consider that your Cpk is probably different for both placing large and small components. * Probably your routine placement rate SB the speed you use to monitor the accuracy of your process. * Some people use a calibrated glass test
Electronics Forum | Thu Jul 12 17:43:50 EDT 2001 | Steve
In order to understand your printing process, you cannot rely soley on 2D inspection. By implementing 3D-true volumetric measurement, a more comprehensive approach to correcting the process variation can be established. True volumetric / 3D inspect
Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
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