Electronics Forum: placement (Page 275 of 383)

QFP Shifting / Solderability Issue

Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika

These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,

01005 Qualifications - Lead Free

Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem

Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia

When to implement high speed pick and place machines?

Electronics Forum | Tue Feb 04 21:07:16 EST 2014 | sarason

You should ask yourself a bunch of questions before you consider going down this path. The first being where are the bottlenecks in your existing line and is there anything you can do to eliminate or decrease there bottleneckness (made up word). I

SMD Spring Pins Reflow Crooked / Tilted

Electronics Forum | Thu Jan 05 12:28:12 EST 2017 | rgduval

I'd recommend not using them, personally :) The long term reliability of the SMT joint is suspect, IMHO. I had them for an in-house manufactured bed-of-nails test fixture for testing somewhere north of 5000 units....after the first 100, we were rep

How much it costs to building a PCB factory?

Electronics Forum | Sun Feb 05 17:44:47 EST 2017 | spoiltforchoice

Printer->Paste Inspection(which might be a feature of the printer)->High speed placer (for all the little parts)->Accurate Placer(for your BGA Processor,RAM,eMMC and big things that don't fit in the high speed)->Reflow oven->AOI->PCB stacker All of t

Re: footprint formula

Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko

Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to

Re: Paste Dispensing

Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John

John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe

Re: Solder Beading under Cap...Need help

Electronics Forum | Fri Feb 11 09:48:56 EST 2000 | Christopher Lampron

Dear Masdi, Solder beading (as opposed to solder balls) is usually caused by volume of solder paste, displacement of solder paste when component is placed and sometimes the proximity of the solder depositions for that component. Basically, a small a

Re: converting from 0805's to smaller packages

Electronics Forum | Fri Jan 05 15:14:27 EST 2001 | Mark Krmpotich

Currently where I work, we are busy running trials with smaller component sizes. Consumer Electronics is being driven to smaller and smaller products. Just look at the short history of the cell phone. Remeber when they used to look like Army Walki

Re: converting from 0805's to smaller packages

Electronics Forum | Sat Jan 06 10:52:09 EST 2001 | Steve Thomas

I don't know the specs. of our MSHII's, as I'm sort of detached from that part of the process, but supposedly they are capable. Panasonic also recommends we buy all new feeders (well, big surprise there), because of the risks involved with retrofitti


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