Electronics Forum | Thu Jul 29 00:23:45 EDT 1999 | ScottM
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Thu Jul 29 21:00:27 EDT 1999 | Dave F
| Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. | | From what you and some of the
Electronics Forum | Thu Jul 29 12:24:59 EDT 1999 | DLKearns
| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh
Electronics Forum | Wed Jul 28 16:05:12 EDT 1999 | Rob Fischer
| | | Just go look at the thread on stencil cleaners started by Scott Davies in the March 1-15, 1999 achives if you want to see some juicy stuff...then make your mind up about vendor inputs. Pretty obvious if you ask me... | | | | | | -Steve Gregory
Electronics Forum | Tue Jul 20 09:20:39 EDT 1999 | Dave F
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Wed Jul 07 22:27:57 EDT 1999 | Dave F
| | We are looking for some subcontractors to do surface mount | | technology boards for us. Is there anything I should pay specific | | attention when I visit the subcontractor's site? | | Thank you for any advice | | | Hey, there�s already a
Electronics Forum | Fri Jul 02 14:32:44 EDT 1999 | Dave F
| I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/change
Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
