Electronics Forum | Wed Sep 03 12:44:34 EDT 2008 | Bob Douglas
When considering MSD issues two factors really need to be focused on; first, environmental control of the individual subject component/s during storage and second, monitoring of the packages out of the controlled environment. It's important that eac
Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef
Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma
Electronics Forum | Wed Aug 27 17:12:34 EDT 2008 | mikesewell
Silicone contamination could appear as fisheyes or dark spots under UV light. 1A33 can be heat cured but is a single component oxygen cure coating - it needs a source of oxygen to cure. An unvented oven may slow or limit the cure. Check out the TDS
Electronics Forum | Thu Aug 28 21:43:23 EDT 2008 | davef
Couple of points: * We'll tell ya, although it's tough to tell from these pix, but it does not look like dewetting. It looks like nonwetting. * We don't think you're getting this product hot enough. We don't know where you measured the profile you po
Electronics Forum | Thu Sep 04 10:42:29 EDT 2008 | vladig
You are right. That is what process engineers are for. HOWEVER, in many cases they just can not fix a problem because it either in the part, or board or paste and so on. I used ot work for a large company in QA doing lab work for production. In many
Electronics Forum | Thu Aug 28 11:31:17 EDT 2008 | patrickbruneel
Matt solder mask finishes gives the widest process window in view of potential amount of residues when using No-Clean. Shiny (glass like) finishes are more sensitive to residues due to lower surface area compared to matt finish. If the shiny finish i
Electronics Forum | Thu Aug 28 11:07:34 EDT 2008 | saaitk
Can anyone please help me out. I am having solderability issues on a 208 pin QFP. I believe that it may be due to the age of the component. The date code states week 50 of 2003 which is not all that far off 5 years. The component was vacuum sealed at
Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Wed Sep 03 19:54:23 EDT 2008 | vladig
Well, I'm not a sale person whatsoever. I'm a purely technical guy (even PhD :-)) who has been with the industry for quite a few years and I know very well what intermetallics means and how thck it should be for different board finishes and solders
Electronics Forum | Sun Sep 07 09:57:23 EDT 2008 | davef
We have BGA connectors on rigid laminate. Points are: * We love BGA connectors for mating mother/daughter boards because they eliminate the wave solder step required for PTH connectors. * BGA connectors are very tricky to assemble, much trickier than
