Electronics Forum: viewing (Page 2753 of 7890)

Pinging DaveF.....PCB Singulation Systems - hydraulic press?

Electronics Forum | Wed Apr 08 13:13:57 EDT 2009 | rwyman

davef is correct- WAND is part of Tyco Electronics. Or it was when we purchased ours. Beware though- the die sets are expensive.

Pinging DaveF.....PCB Singulation Systems - hydraulic press?

Electronics Forum | Mon May 04 11:09:07 EDT 2009 | billa

Larsen Mfg. in Mundelein, IL makes depaneling presses and dies. The press and dies are similar to the Wand Tool process. Contact Bill Anderson at 847-970-9600.

PCB Singulation Systems - hydraulic press?

Electronics Forum | Sat May 16 13:18:09 EDT 2009 | pioneerdietecs

Pioneer-Dietecs Corporation manufactures depaneling dies and singulation systems. The dies can be used in a Wand press. Visit http://www.pioneerdietecs.com or send a CAD file, PDF or picture file to larson@pioneerdietecs.com.

Lead Free Solder Paste Evaluation

Electronics Forum | Fri Apr 03 14:42:08 EDT 2009 | rkevin

Looking for potential pastes to evaluate (success stories), and any and all paste evaluation procedures you may have used sucessfully to qualify a new product. Definition, slump, release, tack, voiding, reflow window, etc. Thanks for any and all h

Lead Free Solder Paste Evaluation

Electronics Forum | Sat Apr 04 09:41:50 EDT 2009 | davef

While you're waiting for others to replay, search the fine SMTnet Archives, here's an example: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=38918

Lead Free Solder Paste Evaluation

Electronics Forum | Mon Apr 06 12:57:49 EDT 2009 | jdumont

We are using Alpha's OM-338-PT with great results. The PT means pin testable which was selected because its residues are a little softer and clean slightly better.

Lead Free Solder Paste Evaluation

Electronics Forum | Wed Apr 08 16:16:35 EDT 2009 | rkevin

I am looking to use a no clean and want to stick with SAC305 Steve, What would you recommend from Aim ?

Lead Free Solder Paste Evaluation

Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon

We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.

BGA Rework - Pads being lifted

Electronics Forum | Thu Apr 09 07:37:18 EDT 2009 | fowlerchang

Another suggestion for it. Baking the whole boards before rework the BGA. It is not only benifit to the BGA but also to the pad.

BGA Rework - Pads being lifted

Electronics Forum | Thu Apr 09 09:23:29 EDT 2009 | ed_faranda

Well, I did manage to solve this problem. I lowered the max boards temp from 245 to 235. Then I decreased my TAL. This seemed to work perfectly. Thanks everyone for your suggestions! They got me in the right direction.


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