Electronics Forum | Sat Dec 17 13:58:25 EST 2005 | bvdb
Jared, Thank you for the help. AFter following your advice we were able to get the display to say Jog L. However, pressing the UP or DOWN arrow or pressing the "F" key and the UP or DOWN arrow didn't do anything. The trays stay put. When we requ
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Fri Mar 31 12:27:27 EST 2006 | Marcus
We have used the SN100C for over a year now with fanastic results. We use the SAC305 for SMT and SN100C wire exclusively. There are no problem mixing the alloys. I am also on the commitee for the NASA testing. The SN100C did out perform SAC and SnPb
Electronics Forum | Fri Jan 06 10:49:03 EST 2006 | PWH
We had a bad situation with solvent wipe. One of the solvent supply lines cracked and the solvent got on a cluster of air lines. The air line material reacted poorly and we blew what seemed like one airline per day for a couple weeks. I had to cut
Electronics Forum | Fri Jan 06 16:40:34 EST 2006 | Cmiller
We have a 3Z and a 3AV. We dont use the 3AV at all anymore and just took the 3Z out of service but we ran each for 4 years for at least 8 hours a day. We never had problems to the extent you seem to have. I did talk to someone a few years ago that sa
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Thu Jan 12 13:21:11 EST 2006 | barryg
Opinions. I have a large finned heatsink that we place over a D2pak transistor. This heatsink is designed to heatsink the transistor through the junction of the pad area that the transistor is attached to. The paste pattern we chose was small dots ar
Electronics Forum | Thu Mar 30 12:57:21 EST 2006 | cyber_wolf
Fuji has said a lot of things in the past, then changed it later on. Just for the sake of argument....The guys that have trained me worked at Fuji for a minimum of 12 years. Not quite sure what Tech is talking about, but I do not recommend doing w
Electronics Forum | Wed Feb 22 12:06:23 EST 2006 | Chunks
I agree with Steve and would hate to have Ken audit me. "Mrs. Chunks, sure your profile looks like the manufacturers recommended spec, your oven is calibrated to the best you can do or afford, your profiler is also calibrated to the best of your cap
Electronics Forum | Fri Feb 17 09:35:00 EST 2006 | Rob
Hi, I take it you are refering to intrusive reflow? It came around as more components became available in surface mount packages leaving mainly connectors left over for a separate insertion operation & wave/selective/hand solder. Manufacturers imp
