Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas
Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We
Electronics Forum | Sat Sep 20 07:11:28 EDT 2008 | Sean
Hello All, I used to hear that PCB with immersion silver finishing, its non component location pads, tend to be discolour (Yellowish) after went through heat cycle, such as reflow oven. However, if the component solderbility on the PCB is OK, can w
Electronics Forum | Thu Oct 02 15:09:32 EDT 2008 | ck_the_flip
Jani, I got it from a very vague spec. from a solder paste supplier who stated, "It is not advisable to refrigerate an already opened container." Sorry, but I don't have details why. My guess is, several temperature excursions, after the air-tigh
Electronics Forum | Wed Oct 08 15:06:32 EDT 2008 | sambolian
I knew I was doing everything right! I haven't forgot after all. That's exactly what I did, but I still get the error of "Fiducials not taught". I thought that maybe I was forgetting something, but that's not the case :( Maybe I have a bug in my soft
Electronics Forum | Fri Oct 17 04:23:51 EDT 2008 | fujiphil
Check the image using the fast inching [F] and axis selection [2]. After vision error, press [F] then [2]. The monitor will display a binary images. You will now have a visual look on how the error occurs. Adjust the CCD level of the camera until you
Electronics Forum | Mon Oct 20 21:57:58 EDT 2008 | jdt13
The problem that I see is the pads not soldered and I can see on the X-Ray the solder on the pad after reflow, and yes the solder has melted in a uniform fashion, I have not measured the diference of temperatures in each pad of the PCB, the size is a
Electronics Forum | Thu Oct 23 11:11:46 EDT 2008 | bobpan
Ok, been a long time so dont quote me on this.....but i think you have to go into assembler configuration and change a number that is located under each assembler to its own number....ex....assembler 1 assembler 2 . They probably both have a 1 at t
Electronics Forum | Fri Oct 24 06:55:48 EDT 2008 | clampron
Good Morning WS, If you experieced the solder balls after reflow of a bare board through the oven, then the source of the solder is either the oven or the board. I have had boards with untented via's that were HASL'd that had entrapped solder and fl
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
Electronics Forum | Thu Oct 30 09:23:34 EDT 2008 | jwolvans
Hi, Rob. Does the table appear to hang up, then suddenly let go? If so, check the alignment of all four conveyor rail guide blocks, especially if the clamping rails have been recently removed for maintenance. After that, check the piston assembly t
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