Electronics Forum | Mon Jun 11 17:14:13 EDT 2012 | mmjm_1099
1st Question I am working on ROI for a bare board destacker and wondering if anyone has a general guideline to follow. Example of ROI for bare board destacker I have now as follows: $7500 for destacker, Avg panel input 3365, Time to load in panel 7
Electronics Forum | Tue Mar 12 10:16:05 EDT 2013 | bocci572
Yes the components are flat and no larger than 50mm in size. Most are full rings or just an arc of a ring. I understand fully the best way to have the capabilities proven would be to have the vendor demonstrate. I am kind of looking at what people
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Electronics Forum | Tue Apr 23 15:18:02 EDT 2013 | davef
2 oz copper should be 2 oz per ft^2 thick. There is no relationship between thickness and copper weight due to the effect of processing. Since this is a painful way of thinking about things, ppl have reached a compromise and talk about 'nominal thick
Electronics Forum | Tue Apr 30 05:05:16 EDT 2013 | pavel_murtishev
Colleagues, Now I am involved into plant ramp-up where 3x Panaconic NPM-W will be installed. New production hall is being designed right now and the problem is that constructors have never met SMT shops and know very few or next to nothing about requ
Electronics Forum | Thu May 02 15:29:19 EDT 2013 | jim_n_hky
I can't answer your specific question on the floor, but I have some suggestions. The equipment manufacturer should be able to provide the floor loading requirements. A structural engineer should be able to translate that into specs for hte constructi
Electronics Forum | Sat Jul 06 19:49:41 EDT 2013 | sarason
My software can easily open a PCB CSV file so this is probably the easiest way for you to generate a file. The setups are remembered via a write to the registry, so you can go with a standard set of values to arrive at a very usable file without havi
Electronics Forum | Tue Sep 10 17:40:14 EDT 2013 | caurbach
Let me start off by saying that although we pot a decent variety of products, we have never been asked to do something like this, so this is not based on personal experience. This is just my gut talking here. I suppose you could use some sort of ca
Electronics Forum | Thu Sep 19 11:02:17 EDT 2013 | hegemon
If there is only a single lead free BGA on the BOM, I would suggest a "hybrid" profile. Use regular solderpaste (SN63/pb37) and peak your temperature at around 225C. Allow a bit longer TAL to let the two solders co-mingle at the BGA joints. You are
Electronics Forum | Thu Sep 26 15:28:16 EDT 2013 | joeherz
I know - A stimulating topic.... IPC-TM-650 2.3.28 method calls for a PCBA or PCB to be placed into a bag with solution, shake, analyze. Great. There is a method of doing this testing that focuses on a specific area of a PCB or a component where r
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