Electronics Forum | Sat Mar 20 18:48:53 EST 1999 | GSM GURU!
Hey, all you Pro's out there I am looking for someone that has worked with the Universal FlexJet. We have been Beta testing one for a couple of months now and are having problems with interfacing optimization software with it. I would like to know th
Electronics Forum | Fri Feb 12 18:48:19 EST 1999 | Jon Medernach
Bill, You should wipe clean. The thin layer will dry out quickly and cause other problems. Remember squeegee down stop and squeegee pressure are seperate issues. If your downstop is to low the stencil and board will flex down, after the squeegee p
Electronics Forum | Sat Feb 13 07:57:42 EST 1999 | Kelly
| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the
Electronics Forum | Tue Feb 16 08:54:57 EST 1999 | Ross Berntson
| I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:26 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Fri Jan 22 17:03:55 EST 1999 | Ross Berntson
| I'm currently planning to do an evaluation of RMA flux solder pastes for mil type applications. Does anyone have any suggestions for vendors to try? I'm especailly interested in pastes that aid application on boards with 20 mil pitch. | I am fro
Electronics Forum | Mon Dec 28 15:43:22 EST 1998 | Mark D.
We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I realize th
Electronics Forum | Mon Dec 28 19:28:57 EST 1998 | Chad Haima
| We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I realize
Electronics Forum | Thu Dec 24 02:17:22 EST 1998 | Chris Grendler
Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The pit
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