Electronics Forum: bases (Page 283 of 312)

Bare PCB baking

Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas

The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Fri Dec 06 12:24:03 EST 2002 | Mike Konrad

Military and most commercial standards requires post-soldered boards to measure less than 10 �g/in of NaCl (14 when using an Omegameter, 20 on a Ionagraph, and 37 on a Zero-Ion). As Dave stated, 6.5 �g/in of NaCl is called out in Mil-P-55110 for ba

Capability Process CPk

Electronics Forum | Mon Mar 10 15:52:26 EST 2003 | eagle-eyed-one

Hello Neil, I absolutely agree with the conclusion of limits as you have stated. There are 2 sets of limits in which machines can be measured against for compliant performance. First and most critical being the quality performance specification limit

bulk feeding chips

Electronics Forum | Thu Mar 06 01:32:10 EST 2003 | kenBliss

gregp Your question started out asking about the advantages of bulk feeding. Based on the discussion it all comes down to costs. I offer another perspective that I believe is extremely relevant. Any advantage in manufacturing has to come down to

SMT Component rotation problem

Electronics Forum | Thu Feb 27 15:13:35 EST 2003 | stockley

Oh dear, I tried not to respond but i couldn't help myself. Stop me if I go off into the woods. My guess, Chris, based on your fleeting reference to GF files, is that your SMT machines are Siemens Siplace. If this is so then package orientation def

AOI, Quality and SPC

Electronics Forum | Mon Mar 03 13:18:02 EST 2003 | msivigny

Hello phil, The use of AOI systems give us the opportunity to auto-collect defect information much the way you're using them now. AOI systems become extremely effective when the collected data is used to perform some positive change into the process.

MELF component/solder failure

Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef

Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot

Universal 4796HSP D2332 Unit drivers

Electronics Forum | Wed Sep 10 09:56:18 EDT 2003 | vickt

5 years ago (mostly likely 7-8 yrs). Most of these failures can be attributed to simple overtemp conditions or mechanical stress. Customers who do not keep the cooling fan filters clean on their machines tend to see a higher failure rate due to highe

Lead free BGA's & std SnPb paste

Electronics Forum | Thu Oct 30 21:55:27 EST 2003 | johnwnz

Now I've checked the archives on this and found the starts of an answer but not much else, but then that posting was a while ago and I though there would be some more data now. So here's the question: who, if anyone is placeign Pb-free BGA's (ideally


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