Electronics Forum: 4mm (Page 29 of 31)

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Need Help for CCGA Rework

Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS

Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl

PQFP with pitch of 0.4 mm

Electronics Forum | Sat Feb 10 17:12:03 EST 2001 | rpereira

I admit, 16 mil QFP printing is very challenging but if all your control factors (print speed, etc...) are setup correctly (through DOE) extremely high yields can be achieved and more importantly a repeatable and robust product will be manufactured.

Re: HELP!! via sizes, location

Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian

| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 09:33:30 EDT 1999 | Scott Davies

| | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | thanks | | | | | We use 6 mil lasercut stencils w

BULK FEEDING

Electronics Forum | Sun Jun 21 18:06:45 EDT 1998 | Fred Dub

New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for whom the tape feeding for a long time was the solution. The rapid growth in the number of passive component

Re: BULK FEEDING

Electronics Forum | Fri Jul 10 00:04:44 EDT 1998 | Fred Dub

| New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for | whom the tape feeding for a long time was the solution. The rapid growth in the number of passive compo

best buy? (printers)

Electronics Forum | Mon Nov 04 17:29:34 EST 2002 | pjc

Cannot comment on "best buy". You'll have to determine what the better machine is for your application and duration of planned use. I suggest taking a field trip to each vendor's nearest demo facility with a few of your most hi-tech boards and stenci

Manual handling aftrer Pick n place

Electronics Forum | Sat Jan 22 16:39:26 EST 2011 | eadthem

Your typical high mix line would consist of, Stencil printer, 1-2 foot conveyor belt, fast PNP machine (say a universal 30 spindle turret lightning head), 1-2 foot conveyor belt, large/heavy part PNP (say a universal flex jet 7 spindle or 4 Spindle),

Manual SMT equipment

Electronics Forum | Wed Dec 03 06:04:10 EST 2014 | spoiltforchoice

Manual placement aids are often very similar, I would suggest it is quite difficult to tell them all apart. Most of them include some kind of carousel for bins of loose parts and have the option of a few tape "feeders". If you are building small volu


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