Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Sep 30 13:54:00 EDT 1998 | Chrys
All y'all | | BACKGROUND. How many times do you see folks come to work all painted-up and then by the time first break comes, the lipstick, eye liner, and who knows what else are gone and they�re heading for the facilities to "freshen-up." I w
Electronics Forum | Thu Sep 24 20:07:48 EDT 1998 | Dave F
| Does anyone know where I can get conductive benchtops? NOTE: I don't want a mat and I'm already using (and unhappy with) a laminate surface glued to a wooden table. Any and all info would be very much appreciated. | BTW: I'm also looking for conduc
Electronics Forum | Mon Sep 21 12:04:39 EDT 1998 | Chrys
| Say, you company wants you to set-up a new assembly line. You get: | 1 $2 million for any equipment that you want to purchase and no idiot bosses second guessing your choices | 2 New building with good parking and enviromental and ESD controls | 3
Electronics Forum | Wed Sep 23 20:48:03 EDT 1998 | Dave F
| Konichi wa "SMT-netter" sans... | I've been on a fruitless search for some board mount, micro BGA sockets...I don't think they're out there yet, but I don't know for sure. | Found a lot of test and burn-in sockets for CSP's (at more than $1,000 pe
Electronics Forum | Mon Sep 14 18:09:16 EDT 1998 | Dave F
| Our company currently donesn't have any type of sonic wash to wash boards that have been "miss printed" Wanting to know the best way to go about this. So what we are having to do is spray down the boards with alcohol and wipeing the solder paste
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Thu Sep 10 21:48:37 EDT 1998 | Dave F
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Mon Sep 14 04:13:53 EDT 1998 | Jeff sanchez
| Thanks for the help, Guys. | As a matter of interest, I'm going to look up the standard and see if there's a European (or preferably UK) equivalent. If I find anything, I'll post another Follow Up (though I doubt it holds much interest for you)! |
Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
