Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Thu Aug 05 06:58:04 EDT 1999 | Graham Naisbitt
| | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmental co
Electronics Forum | Mon Aug 10 21:41:31 EDT 1998 | Dave F
| What exactly is the criteria needed to determine the right solder paste. I have been fortunate enough in the past to have a solder paste work "halfway" for me and to modify the reflow profile or simply just "drop in" a paste and monkey with the pro
Electronics Forum | Wed Jun 14 11:37:44 EDT 2006 | shawnvike
find the problem? Were the parts failing > electrically? Or did someone start prying them > and decide they were too weak? Originally found the problem going through some older assemblies that had failed testing. Poked at leads and found them no
Electronics Forum | Fri Dec 21 13:51:16 EST 2007 | howard stevens
Gentlemen, This is an interesting topic. If one refers to the Nihon Superior patent, they make the following claims. "Germanium makes the crystal finer when the alloy solidifies. Germanium appears on a grain boundary, preventing the crystal from b
Electronics Forum | Wed Aug 11 11:54:50 EDT 1999 | Dave F
| | Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulati
Electronics Forum | Wed Jan 06 23:01:48 EST 1999 | Dave F
| | Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socke
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Electronics Forum | Wed Dec 09 21:45:11 EST 1998 | Dave F
Graham: I agree. Very thorny. What is clean?? And how is that controlled?? Back 25 or so years ago, soldering was done with high solids rosin fluxes. The issue with cleanliness was ionic contamination. The US military and others set a fairly a
