Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef
Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot
Electronics Forum | Fri Feb 20 12:55:43 EST 2004 | russ
Ah, the old contour wave. I don't really know how to adjust those to get correct backflow to reduce your solder volume. I need to ask why you are worried about this. Do you have a QC requirement in excess of IPC class3 wich allows for this joint t
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Mon Jun 21 11:14:25 EDT 2004 | exmaintenanceleader
Dear Kanwaljit Singh, my opinion is following: 1)solderpaste type is ok - usual (alpha-metals has this problem inside the paste paste- holder problem) - what do the operator when production change -clean well the stencil holes!! no visible rest on
Electronics Forum | Tue Oct 12 11:06:11 EDT 2004 | stefwitt
At least the few people left in this industry should make a stink, why all these jobs went to China and take efforts to get them back. If I take a typical line, which can do 20,000 components an hour, costs $ 200,000, a board with 50 different compon
Electronics Forum | Fri Mar 18 15:02:07 EST 2005 | pmd
Please clarify, Z axis gears (Blades)? The MPM head I believe is what your are asking is driven up and down via a lead screw. The machine gets the zero point from the "HAT" tactile sensor in the table nest. When squegees are installed the blades are
Electronics Forum | Thu Apr 07 08:02:44 EDT 2005 | Grant
Hi, I used to run a clean room, and it's right, most of the dust is created internally. You will need to add some HEPA filtering to the area, and an air handling unit that can control temp and humidity as well to get correct environmental control.
Electronics Forum | Mon May 02 18:54:28 EDT 2005 | MikeaJ
The answer you are looking for is part of your initial setup of the board and stencil. This information is to be found in the PCB setup menu/icon. The reason why the stencil loading pins are impacting the frame is because the default setting of the s
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Tue Aug 23 20:46:41 EDT 2005 | darby
If I had my way - the person checking the incoming kit should be able to at least run, troubleshoot and preferably programme the SMT line. In fact they should be an expert.They have the paper work in front of them for that job. If the tape is cut - t
