Electronics Forum | Sun Feb 07 10:51:09 EST 2010 | davef
The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.
Electronics Forum | Sat Feb 06 16:28:09 EST 2010 | mystkldy
I have some large ROHS SMT inductors that are moving during the reflow process. I have tried adding extra solder, gluing and doing both. I don't know what else to try, any suggestions?
Electronics Forum | Thu Feb 11 15:11:57 EST 2010 | hegemon
Speaking from experience, my vote goes to Mirtec MV-3 or MV-7 with the 4 Megapixel camera setup. 2 Megapixel cams won't inspect that small, other than for presence Yestech also has machines that are suitable for this work. No company affiliations,
Electronics Forum | Tue Feb 16 12:52:45 EST 2010 | esoderberg
I have two Yestech machines, the latest is a 5 megapixel camera machine. These are used every day all day. Excellent machine.
Electronics Forum | Mon Feb 08 14:32:01 EST 2010 | davef
We believe that neither xray nor SAM will provide satisfactory results and that sectioning throughout the process will provide conclusive information.
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Mon Feb 08 17:11:34 EST 2010 | woodsmt
Thanks Dave and Glenn, I have setteled on Dye for the destuctive checks, and was thinking about impedence testing at intervals during ESS. Based on the research I have been doing the last several days, this seems like a method that should identify
Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Mon Feb 08 23:44:31 EST 2010 | glennster
Woody, Daisy chain packages are definitely needed, but if you can get packages with a dummy chip inside these will provide a more accurate simulation of working components. If possible, continuous monitoring of resistance during the test will be
Electronics Forum | Wed Feb 10 12:15:40 EST 2010 | woodsmt
Daisy chained parts and impedence testing were my original reccomendation. Unfourtuantely I can not get the resources for this testing.
