Electronics Forum | Wed Nov 10 02:13:32 EST 2004 | Grant
Hi, We are thinking about starting to use via in Pad, for both BGA and 0402 and 0201 components. Does anyone know how this would effect production. Obviously PCB production is not difficult, but this should only effect production and assembly. R
Electronics Forum | Tue Mar 15 22:10:39 EST 2005 | KEN
Why in Gods name would you use no-clean and then clean it? ....I guess I just don't get it.
Electronics Forum | Wed Mar 16 02:06:13 EST 2005 | amstech
What is the joint stand-off gap anticipated after the board level assembly and reflow? If it is designed per CSP standards, there should be no issue in water cleaning. If the gap is 90 � 100 micron, better to go with a no clean paste. His needs good
Electronics Forum | Tue Jan 04 21:32:49 EST 2005 | davef
We've had several conversations about that here on SMTnet. Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30307
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Fri Dec 24 06:20:05 EST 2004 | Steve
Find another component supplier. If you believe that Crap I have some land I wish to get rid of.
Electronics Forum | Tue Dec 28 22:29:14 EST 2004 | davef
Doesn't make sense. Either your: * Oven is not operting properly [attach your profiler thermocouple to the baffle of each zone with a screw to check] ... OR * Conveyor speed is too high ... OR * Profiler is defective
Electronics Forum | Wed Jan 12 09:08:33 EST 2005 | carobin
I was looking to see how others are handling conformal coating PCBs containing BGAs. We have looked at underfills, but none meet the reworkability we need.
Electronics Forum | Fri Jan 14 17:09:21 EST 2005 | Bob R.
Whether or not conformal coating creates a reliability problem if it bridges the gap between the board and bottom of the part depends on the properties of the coating. A low modulus coating is fine, but one thats modulus increases at colder temperat
Electronics Forum | Wed Jan 12 17:47:13 EST 2005 | Dreamsniper
I wanna make a MSExcel spreadsheet that will automatically convert Percent Area of a BGA void to Percent Diameter. What is the formula? Thanks and regards,
