Electronics Forum | Thu Jul 17 11:36:41 EDT 2003 | caldon
My AOI wish list would include features that: 1)Character recognition, 2) Correct Placement (including missing), 3) Solder joint inspection (solder present), 4) Shorts, 5)Polarity check, 6)Coplanarity, 7)gerber/or Cad compatible (no gold boards), 8)e
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee
| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform
Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Tue Aug 29 06:00:47 EDT 2006 | bwet
Ladies and Gents: There have been several studies including (http://www.solder.net/PDFs/LeadFree_BGATesting_InitialCycling_BEST.pdf) which have shown lower fast pass yields with solder paste. Based on internal projects of 1000+ of the same BGAs we a
Electronics Forum | Mon Dec 04 14:27:18 EST 2006 | pjc
Solder preforms can be used in SMT assembly for through-hole pin-in-paste process. In this process and modified aperture is used to print the paste with standard stencil printing, then a solder preform is picked and placed by a machine into the solde
Electronics Forum | Mon Dec 27 13:34:28 EST 2010 | ppcbs
Does anyone have any experience in printing solder paste on a 0.0065" pad? I have a requirement to attach single chips with 600 to 2400 connections. The chip has a 0.005" solder ball, 0.010 pitch. Attaching to a substrate with a 0.0065" pad. An
Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Thu Aug 02 09:56:57 EDT 2012 | mccabekev
We currently operate a procedure of keeping fresh tubes of solder paste in a fridge. When it is required we remove the required quantity from the tube and return the tube to the fridge before it warms up to room temperature. We then store this at r
Electronics Forum | Wed Mar 12 15:26:46 EDT 2014 | dan_ems
Hello, in my SMT process I have some problems with the solderability (look like dewetting) on a PCB with finish HASL Lead Free with a composition that is melt at 230 degree Celsius. My oven is with vapor phase and the peak temperature is 230 degre
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