Electronics Forum: each (Page 290 of 304)

Voiding in board to BGA joints

Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan

Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi

What standards should electronic manufacturing meet?

Electronics Forum | Fri Apr 02 10:12:06 EST 2004 | mapell

Hi Dilbert We manufacture equipment for the electronics industry. The holy grail "guide book" you looking for does not really exist. I wish it did. I got with our compliance engineer this morning for help explain since I am not that experienced i

Solder Paste Thickness Measuring Device

Electronics Forum | Thu Mar 18 12:32:16 EST 2004 | steve_arneson

There are many low cost paste inspection systems on the market today. It really depends upon your overall needs for process improvement. The CyberOptics LSM series of inspection devices use a single laser stripe to calculate both Height, Area and V

Manufacturing in China, Revisited

Electronics Forum | Tue Oct 19 13:03:16 EDT 2004 | pjc

Electronics manufacturing moving to China is not about the labor man. You all don�t get it. It�s the material, and not just the electronics material either. Plastics and metal parts costs are lower. Labor costs are the smallest component of a produc

Yamaha/Philips Model Number Cross References

Electronics Forum | Thu Jul 07 19:39:18 EDT 2005 | darby

This is a very difficult question to answer as it will depend greatly on your component mix. I will presume that the CSM 84VZ is of the following configuration: 2 x RDC Synchro Heads. Heads 1 & 2. These are mechanically centering heads with a chucki

Quad 1000, looking for opinion

Electronics Forum | Wed Nov 02 14:31:55 EST 2005 | erokc

First about the forum posting, my displayed name "Dave" comes up as my logon name "erokc" on this computer, not so on another computer I use??? Author names that allow email can be selected like "Dave". Bobpan, click on "Dave" to send an e-mail. Y

QFP Shifting / Solderability Issue

Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika

These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,

Universal Instruments Radial Inserter

Electronics Forum | Mon Jul 30 16:21:33 EDT 2007 | gmoritz

I'll respond to this one since it is the most poignant post in this thread: ------------------------------------------------------ Most of what follows is common sense, but sometimes we need to get grounded to remember these common sense things. ---

Stencil for BGA re-balling

Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef

By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11

Researching placement machines - where do I start?!

Electronics Forum | Wed Nov 04 11:35:01 EST 2009 | dilogic

1. can you load cut tape onto the feeders, or only reels? You can, but you have to use cover tape extender (pretty cheap, though) >2. how about parts on trays (like Atmel AVRs in the QFP package)? You need tray feeder. But you can "make" your own


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