Electronics Forum: designation (Page 30 of 537)

EMI

Electronics Forum | Sat Oct 05 07:29:48 EDT 2002 | davef

Design for the Environment (DFE) / Electromagnetic Compliance (EMC) ------------------------------------------------------------------- "Noise Reduction Techniques in Electronic Systems" Henry W. Ott, John Wiley & Sons, New York, 1976 Seltzer, G.S.

Solder Joint Strength

Electronics Forum | Tue Aug 28 16:41:42 EDT 2001 | davef

Very few concern themselves about the strength of solder connections, because it doesn�t require much strength to keep a solder connection attached to the board. More important are factors that arise as a result of the different materials properties

Board Fiducials

Electronics Forum | Thu May 29 12:06:25 EDT 2008 | bsumfg

This thread is a pleading for all those PCB Design experts. A good design person with experience will design for manufacturing as well as to please the customer. Actually that goes hand-in-hand. If a board is designed well from a manufacturing standp

Re: Reliability test on PCBA

Electronics Forum | Thu Dec 21 22:31:28 EST 2000 | Dave F

Sorry, but I'm a bit fuzzy on the goal here. Let me be basic. The basic reasons for reducing the life of products before they're shipped are: * Design qualification. This highly accelerated test beats the living stuff out of products to identify d

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Fri Dec 15 15:59:35 EST 2000 | Hussman

Dave, It will all be about the same - changing atmospheres does not affect your heater output. You may experience some differences in the way your solder joints look (a little duller), but with some of the newer pastes out there, you can overcome i

Perforated Tabs

Electronics Forum | Mon Jun 19 14:53:28 EDT 2000 | Mike Demos

I'm looking for some design paramters for perforated tabs. These are the tabs that connect the circuit board to the break-away pannel material. I've never used these before, but I've seen some that have reportedly worked well. These tabs are ident

Stencil design for dpack

Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink

We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance

Hardware Torque requirements

Electronics Forum | Wed May 16 14:33:36 EDT 2001 | John

The size/type of screw and its preloaded torque are determined by the type and intensity of the load being applied to it. This should be known or estimated by the engineer that designed the product. Then they'll typicly apply a large safety factor

Recommanded profile for 0402 & 0201.

Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve

I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen

Heat sinks re:reflow pad design

Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc

The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper


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