Electronics Forum | Mon Feb 09 07:55:16 EST 2015 | jax
Without knowing the surface finish of the PCB lets focus on an alternative problem... At a minimum, you need to look at the 1/2 built assembly like individual components, all having their own MSD levels and all subject to 2nd side reflow temperatures
Electronics Forum | Mon Aug 07 13:05:55 EDT 2000 | Simon
I'm looking for some documentation on PCB. How it's made. What is the properties of each finish and so on. If someone could give me a site or a book I could look at I'll appreciate. Thanks Simon
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963
If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde
Electronics Forum | Thu Dec 08 22:41:44 EST 2005 | davef
Mike: You're correct, but in better shops there are guys with little black books in their back pocket. They know how to contol their variables and give you a good product. I worked at this plant where we cooked dirt. It glowed orange-red and flow
Electronics Forum | Fri Dec 09 08:53:12 EST 2005 | russ
We used flash gold once by mistake and we did pay for it. A very high fallout of BGAs and some of the leaded devices for latent failures from fractured solder joints. I do not know how the other types of components faired in this process but I woul
Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy
Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation
Electronics Forum | Wed Dec 14 08:58:27 EST 2005 | russ
We experienced brittle solder joints that did not withstand thermal cycling as I was told. I am positive about the fractured joints but was informed by customer that it was thermal cycling of the part when they failed so they were latent failures.
Electronics Forum | Thu Apr 16 14:31:04 EDT 1998 | Lou Madge
Dear Colleague, A seminar titled "Things that you should know before selecting an alternative surface finish" will be offered on Friday , April 24 in Philadelphia (during the Nepcon East week). The seminar will be covering topics related to the SERA
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