Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno
Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only
Electronics Forum | Wed Jun 19 22:03:23 EDT 2002 | davef
If you can assemble flawless products with these boards, do not be concerned about post-assembly quality issues. There is no current related specification in the US. Although, there may be some old military specifications that apply, but you would
Electronics Forum | Fri Jul 12 12:04:51 EDT 2002 | jax
The Lizard Tongue is just a thin metal strip that, when actuated, slides over the BGA component and holds it down during transport. If you contact FUJI, they should be able to give you a part number, and install instructions..... maybe even the real
Electronics Forum | Thu Aug 29 20:02:58 EDT 2002 | davef
Often assemblers leave areas unsoldered for future component additions, modifications, and test points. On imm silver boards, these unsoldered areas become a real bear to solder/test later in life. One way to avoid that problem is deposit some solder
Electronics Forum | Fri Sep 06 14:07:20 EDT 2002 | ppwlee
Thanks for all replying to my printing SPC posting. I like to expand the SPC discussion on reflow and wave soldering. I am aware of the common methods of applying periodic measurements using test vehicles though the machines to collect critical pr
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Tue Oct 01 16:50:26 EDT 2002 | dragonslayr
Just checked the archives with no real success so I am asking here. Are there recommended no clean pastes for SMT reflow of BGA's? Seems to me in recent threads a pro and con issue of whether or not to use no clean for BGA's is raised. The BGA in
Electronics Forum | Wed Oct 02 11:44:58 EDT 2002 | slthomas
We found that a slightly more active flux was all we needed to provide sufficient wetting on the one AgPd part we put down. Unfortunately the paste we tried also slumped terribly, so we nixed that fix. It's a low volume product (50, once every 3 mo
Electronics Forum | Thu Oct 24 17:32:54 EDT 2002 | ksfacinelli
The big problem we saw was the appearance of the solder joint after the water wash process. We saw the joints turn white through the absorption of moisture. Looked real bad but still functioned. I would stick with using only one of the processes a
Electronics Forum | Mon Dec 09 08:13:06 EST 2002 | MA/NY DDave
Hi Yes it is common to design for more uniform heat transfer during the soldering phase or even during the operation phase. It all depends on how bad the problem is during automated assembly or during usage. The only difficulty is that the designer
.gif)
