Electronics Forum: solder joint separation (Page 292 of 317)

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Tue Jun 08 11:54:17 EDT 1999 | Steve Skinner

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Soltech Sorrows...

Electronics Forum | Sat Mar 06 18:09:31 EST 1999 | Steve Gregory

Hi Ya'll... I'm in here again today trying to deal with my down wave solder. I've been beatin' my head against the wall for the last couple of days, it's a Soltec Prisma and the conveyer keeps jamming. What it's doing is up at the exit end where th

Inspection Machine Capability

Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy

Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both

Re: Solder Mask IPC Standard

Electronics Forum | Sun Oct 10 17:40:50 EDT 1999 | JohnW

| | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | PCB is FR4 | | | Solder Mask is LPI | | | Reflow and W/S Profile = Standard

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 12:41:20 EDT 1999 | stefano bolleri

| | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | This is what I did. | | | | Created a removal pr

Re: Cleaning No-Clean

Electronics Forum | Fri Oct 16 13:11:49 EDT 1998 | Steve A

The Kyzen product was brought to my attention from a chemist at Kester solders when I asked him what could remove no clean residue from a PCB that had been built weeks earlier. We soaked it in the Kyzen for 8 minutes and ran the board through the aq

Re: Voids - correlation with a not wetting PCB

Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon

| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn

Re: Gold boards OK with SMT?

Electronics Forum | Fri Aug 07 07:52:15 EDT 1998 | Earl Moon

| | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not e

Re: PCB panellisation

Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley

| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati


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