Electronics Forum: corners (Page 30 of 68)

BGA CORNER WARP

Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark

BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think

BGA Assembly Misalignment

Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen

Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a

Can local fiducials improve BGA placement?

Electronics Forum | Wed Jun 06 16:51:06 EDT 2001 | jax

Unless your placing micro-bga, board edge fiducials on alternating corners will provide more than enough placement correction ( Micro-bga's should also be fine depending on how your equipment maps the board ). The part data and vision recognition nee

Career Center

Electronics Forum | Tue Feb 08 09:55:51 EST 2000 | Scott Davies

May I make a suggestion with regard to the "Jobs Available" section of the SMTnet Career Center...as well as the "Job Category", "Company" and "Modified" fields which appear on the main page of this section, could you also include a field which shows

Re: Siemens ( Siplace ) BGA inspection

Electronics Forum | Fri Nov 19 16:36:15 EST 1999 | JAX

Thank you for the info but when I say anchor I am asking if it uses only one ball (pin one). I believe you are saying it uses a predefined number from every corner to map out the part according to the description given inside the GF. If this is true,

Re: paste release from stencil - recommendations

Electronics Forum | Sun Nov 21 13:48:16 EST 1999 | Steve Thomas

We're going to 5 mil foil from 6 mil, with a 10 mil aperture, radiused corners. Supposedly going to traps. from right angles, but who knows? We've got temp. controlled at ~73F, but no RH control. We are going to also try out a more humidity toleran

Re: No follow up, no participation

Electronics Forum | Wed Sep 29 18:40:24 EDT 1999 | Clifford Peaslee

Earl, Everything is quite hectic here. We are still trying to get our stuff together from Cunli's absence. It is difficult to replace him. Please don't take offense from my slow response time. We are aware of the problem of lack of communication and

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 13:43:33 EDT 1999 | Glenn Robertson

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 15:50:30 EDT 1999 | R Scheller

Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? What I'm really after is anything describing how close a screw/washer/nut combination which

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Tue Jun 22 08:52:09 EDT 1999 | Cunli Jia

| | | I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. | | | | | | Sorry for the inconvenience. | | | | | | | | | | | regular or filter? | | I am having the same


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