Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Thu Nov 11 10:09:06 EST 2004 | D.B.Davis
Dear Colleagues, I am working with a new prototype product that is presenting some interesting problems. My Engineering Dept. has made some suggestions that I find a little odd. I am looking for some confirmation from fellow SMD personnel as to the
Electronics Forum | Wed Aug 24 10:07:56 EDT 2005 | stepheniii
I think where the fuzzy thinking starts is by calling the recipe's; profiles. Or maybe I"m being too fussy. Idealy you want every solder joint to have the same thermal "profile" (not recipe). That is the temperature over time is best if identical fo
Electronics Forum | Wed Jun 06 15:59:25 EDT 2007 | chrisawallace
WML, I won't dispute math but I will definitely point out either bad math or a missed target. In your example, you are comparing "Energy used to heat the solder and keep it warm" versus "Energy used to keep the solder warm" and fully discount the fa
Electronics Forum | Sun Mar 18 18:01:00 EDT 2018 | spoiltforchoice
Reckless that's easy : Tabletop units are a joke, you could just as well go build one yourself with a toaster oven and a controller, the results won't be great but at least you won't have spent $5k on one with a ssnazzy screen. "Hulking Units" - wel
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Fri Dec 22 09:39:22 EST 2000 | CAL
Some random Ideas when I read you post...... 1) If it works don't fix it. 2) Be aware of the temp threshold of your components....Over heating components is not good. Over heating is not good period. 3) The Solder paste Chemistry you are using maybe
Electronics Forum | Tue Jul 18 11:50:26 EDT 2000 | Jeff Sanchez
Hey all, My brother is a tech at TI. He is running tests on bump dies. The question is if he heats up a die (actual waffer) with out disrupting the solder can he still use the solder. Will the solder lose its integrity? Keep in mind that these
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
