Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg
There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of
Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Aug 07 09:44:44 EDT 2012 | parmar01
Hi All Im new to the forums, And this my first thread. im the production manager at Broyce Control Everything ive learnt about wave soldering is by trail and error i know its not the best way but it has worked for me. The problem i have been
Electronics Forum | Fri Sep 23 12:42:40 EDT 2011 | scottp
A solder drip like that is completely unacceptable. That could easily short two QFP leads. Very poor quality. Your customer is right to be upset. You need to pony up the money for IPC-610, agree with your customer to which level you're working (1
Electronics Forum | Thu Jul 15 10:33:59 EDT 1999 | Michael Zadrejko
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Mon Feb 07 09:03:15 EST 2005 | Chunks
This paste does tend to solder ball - but short of changing paste you can change your stencil to accommodate it. First, why 10 mils? Seems very thick. What size parts are your working with? Typically you can �homeplate� the R�s and C�s and this
Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob
You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a
Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper
Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0
Electronics Forum | Wed Jul 14 13:10:49 EDT 1999 | Earl Moon
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
