Electronics Forum | Thu Oct 18 11:20:52 EDT 2001 | furrer
1. Does anyone has seen results for the reliability of Solder Paste containing less than 1% Silver. (It is in use for soldering 0402 components because of Tombstones. 2. Is it common to use eutectic Solder Paste SnPb, without any silver, for regular
Electronics Forum | Wed Mar 27 17:14:10 EST 2002 | davef
It is certainly a process indicator. What is causing this condition? Is it a chip that has its toes over the edge, edging towards tombstoning? Contact: * Jack Crawford [ JackCrawford@IPC.ORG ] * Mel Parrish [ mparrish@SOLDERINGTECH.COM ]
Electronics Forum | Thu Oct 31 14:35:19 EST 2002 | russ
You may want to turn the nitrogen off altogether, in searching through the archives it has been stated and proven by many people that this could help a lot. I don't know why it appears to be outside temperature related. Could it be that the PPM le
Electronics Forum | Tue Feb 04 17:24:07 EST 2003 | jonfox
we have some pretty tight 0402 placements and our best fix was to reduce the pad (vertically speaking) from .030x.022 to .020x.022. Fewer tombstones and the paste flows out to the edge of the pads nicely. Only difference is that we have a 6mil sten
Electronics Forum | Wed Feb 26 15:27:21 EST 2003 | robert valles
Sounds like someone before you was dealing with tombstoning components. We have had greater success with triangular paeratures for 0603 and 0402 footprints. Granted the pad will not be wetted completly but IPC requirements are maintained.
Electronics Forum | Sun Mar 16 20:46:18 EST 2003 | MA/NY DDave
Hi Good, that is one of the things I see some have done. With paste too thick these little components float too much off, rather than centering. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 14:01:34 EST 2003 | MA/NY DDave
Hi I understand that more circular or rounded pads also reduce the effect. I love it when many independent variables can alter the outcome. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 14:05:17 EST 2003 | MA/NY DDave
Hi Rene Great, I am glad to see that you are recommending by experience placement control as affected by the pick operation. Neat to see you are also noting a thinner paste deposition. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 27 12:25:14 EST 2003 | kenlchin
additonally, minimizing the rising rate aroud 183'c and decrease the droping rate(near 0.8'c/s) is also a good way .
Electronics Forum | Thu May 01 17:49:33 EDT 2003 | jym2000
Did you check board orientation into the reflow oven? (The Layout components are the same products A & B?) Regards Jesus
