Electronics Forum | Sat Sep 18 02:57:09 EDT 1999 | bach huss
| | Hi All, | | | | I am running 19 Siemens S20 Machine here. I found out that the Siemens Machine once a while hangs. The remedy is reboot the machine. I wonder what is the machine hang rate for other S20 machine else where. | | | | Can anyone giv
Electronics Forum | Sun Sep 12 05:59:32 EDT 1999 | JAX
| Hi All, | | Does any one out there have SPC control on Chip placement Machines? I was wondering what type of parameters we can monitor. We have Siplace here equip with SEC-GEM and a monitoring software. Just curious if anyone has done SPC on Chip
Electronics Forum | Mon Sep 13 10:55:44 EDT 1999 | K3 Equipment
| Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h
Electronics Forum | Thu Sep 02 12:01:49 EDT 1999 | stefano bolleri
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you talking about "primary" process or rework? Are you sure you have not clogged apertures on your stencil? What is the pitch of the balls? My experie
Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon
| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I
Electronics Forum | Tue Aug 17 03:33:26 EDT 1999 | Scott Davies
Anybody using trolleys with the pick-n-place machines and do you splice to the empty reels? Does it work ? ================================================================= I can totally support Charles' comments with regard to reel splicing, ie. if
Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup
| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon
Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Mon Jul 26 18:03:45 EDT 1999 | John Thorup
| We only do rework with SMT components or a small amount of SMT work. We are having a hard time keeping the components safe throughout the handling process of removing one or two components, and issuing them to an operator for processing or inspect
