Electronics Forum: after (Page 295 of 698)

Universal GSM and 0402/0201 Placement

Electronics Forum | Fri Jan 16 12:57:33 EST 2015 | jax

The GSM can place the part from a XY positioning standpoint without issue. You'll have to look at what camera you have to know if the machine can inspect it. After that you need to decide if your feeders can accurately provide the part to the machine

PCB SHELF LIFE AFTER FIRST REFLOW

Electronics Forum | Mon Feb 09 07:55:16 EST 2015 | jax

Without knowing the surface finish of the PCB lets focus on an alternative problem... At a minimum, you need to look at the 1/2 built assembly like individual components, all having their own MSD levels and all subject to 2nd side reflow temperatures

Can anyone tell me that between Mirtek & Kohyoung which AOI machine will be better and why?

Electronics Forum | Thu Feb 12 21:14:37 EST 2015 | kahrpr

They are both very good machines however Kohyoung will give you better first pass results meaning a lot less false calls and when you run the first board after initial programming you have to fix very few things. However the cost is a lot more. This

Mydata

Electronics Forum | Wed Feb 25 12:36:18 EST 2015 | Svajunas Astrauskas

Our company have Mydata MY100DX mashine. When assembling project it lags. Assembling - several seconds thinking (sometimes till 10secons) - assembling and this problem repeats all time. When button is pushed it sometimes reacts only after 1-10 secon

Alpha tetra bond stencils vs Vigon SC200

Electronics Forum | Sun Apr 05 07:00:31 EDT 2015 | vitrost

After washing a tetra bond stencil at PBT machine (Vigon SC200, 50 deg Celsius by 20 minutes) some signs of glue degradation were seen. Does anybody have an experience washing tetra bond in Vigon? What temperature regime is preferable? Thanks

how can i calculate amount of solder paste for a single pcb?

Electronics Forum | Thu May 07 02:16:45 EDT 2015 | buckcho

i need a menthod for calculating amount of > solder paste need in a single pcb or a lot of > pcb(1000 pcb). i need reduce wastage of solder > paste in the process , so any one can > help........ Hello, you can measure the weight, before the pas

ROHS compliance for contract manufacturer

Electronics Forum | Fri Jul 24 17:08:04 EDT 2015 | cnotebaert

little behind are we? look in the archives from 2002-2005 when ROHS was implemented. however no real requirement here, ask your customer what they are after, most simply want a c of c stating its ROHS compliant, if your are talking REACH, that's a en

Flux Fluxing applciation standards

Electronics Forum | Tue Jul 28 14:47:42 EDT 2015 | e405453

Hi to all, I'm new to this. My question is is there any standard that tells how much flux you should add to a PWB? My boss tells me they used to do process control by weighing the PWB before and after so guestimate the amount of flux. but Is ther

Universal GSM Feeder Issues

Electronics Forum | Fri Aug 14 08:52:34 EDT 2015 | rgduval

Gah! We found the reel empty sensor on the feeders late yesterday. Now, I'm feeling a little dumb after this episode! Apparently, I have a few feeders that have had this "feature" disabled (or that it's broken on), which made it even more di

Silver through hole

Electronics Forum | Tue Aug 11 03:27:10 EDT 2015 | iamera

Hello, I am new in this forum and also new in PCB manufacturing. now we have issued about silver open and short. we can detect this defect after auto check process and its to late to save our PCB. Is there any way to detect silver open or insufficien


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