Electronics Forum | Sat Mar 06 09:50:38 EST 1999 | Dave F
A recent thread ... Pre-heat for Ceramic Capacitors - Igmar 10:21:55 03/04/1999 ... was addressing something that was discussed in an earlier thread. I searched 'til I was ARRRRRRHHHH! without finding the earlier thread. The weird part is: Search
Electronics Forum | Mon Mar 08 04:51:43 EST 1999 | John Godfrey
| We are currently looking into purchasing a high volume, medium mix production line. We are considering several different vendors and I would like to know if current users of Siemens equipment are happy. Are the machines maintenance intensive? Ho
Electronics Forum | Fri Mar 05 10:22:27 EST 1999 | Mike Wagner
| We are trying to decide between a Contact Systems Model 3AV or a Multitronix Model DHM120 P&P machine. Any advice or feedback would be apreciated. | | Joe | Why not consider the Philips Topaz. The worlds number one seller in mid-range placement m
Electronics Forum | Wed Feb 24 11:05:13 EST 1999 | justin medernach
| I am profiling a BGA for the first time and I am seeing temperature flucuations on the ramp and cool down from the thermocouple I have placed through the pcb and under the component. I am using a 5 zone convection oven.Any suggestions on the plobl
Electronics Forum | Wed Feb 10 17:00:44 EST 1999 | James Seagle
Does anyone have experience placing a Pinrex 2mm 2x20 SMT header. The dimensions of the part are as follows: length 40mm (1.58"), width 6mm (.236"), height 5.35mm (.211"), pitch 2mm (.079"). If so, what type of centering are you using? Any advice
Electronics Forum | Wed Feb 03 15:18:25 EST 1999 | Michael Allen
I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the part; th
Electronics Forum | Thu Feb 04 03:18:31 EST 1999 | Teemu M�kiniemi
There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow. Chris G. Can you tell me more about the process, or
Electronics Forum | Mon Jan 11 20:26:54 EST 1999 | Chris G.
I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chips
Electronics Forum | Fri Jan 08 16:31:05 EST 1999 | Jason Tomlinson
Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what acti
Electronics Forum | Fri Jan 08 08:46:56 EST 1999 | Tad Anderson
I am searching for application notes on the SOD-80. Also, I am looking for any problems that have been discovered while using it. Also, we are looking for the pick and place equipment upgrades that will be needed to use the package- Pricing, manufa
